Title :
Converting the waste mixture of sulfuric acid and hydrogen peroxide into a coagulant to treat wastewater from a semiconductor plant
Author_Institution :
Environ. Technol. Solutions Office, Sony Corp., Yokohama, Japan
fDate :
30 Sept.-2 Oct. 2003
Abstract :
We report a new method to convert the waste mixture of sulfuric acid and hydrogen peroxide used for cleaning silicon wafers into a coagulant, aluminum sulfate, to treat the wastewater discharged from a semiconductor plant using the reaction between the waste mixture and aluminum hydroxide. The coagulant produced has essentially the same coagulating efficiency as conventional aluminum sulfate.
Keywords :
aluminium compounds; coagulation; electronics industry; hydrogen compounds; industrial plants; industrial waste; wastewater treatment; Al2SO4; H2O2; H2SO4; Si; aluminum sulfate; cleaning; coagulant; hydrogen peroxide; semiconductor plant; silicon wafers; sulfuric acid; waste mixture; wastewater; Aluminum; Cleaning; Coagulation; Inorganic chemicals; Purification; Semiconductor device manufacture; Silicon; Slurries; Wastewater treatment; Water heating;
Conference_Titel :
Semiconductor Manufacturing, 2003 IEEE International Symposium on
Print_ISBN :
0-7803-7894-6
DOI :
10.1109/ISSM.2003.1243218
