• DocumentCode
    2264291
  • Title

    Converting the waste mixture of sulfuric acid and hydrogen peroxide into a coagulant to treat wastewater from a semiconductor plant

  • Author

    Inagaki, Y.

  • Author_Institution
    Environ. Technol. Solutions Office, Sony Corp., Yokohama, Japan
  • fYear
    2003
  • fDate
    30 Sept.-2 Oct. 2003
  • Firstpage
    3
  • Lastpage
    5
  • Abstract
    We report a new method to convert the waste mixture of sulfuric acid and hydrogen peroxide used for cleaning silicon wafers into a coagulant, aluminum sulfate, to treat the wastewater discharged from a semiconductor plant using the reaction between the waste mixture and aluminum hydroxide. The coagulant produced has essentially the same coagulating efficiency as conventional aluminum sulfate.
  • Keywords
    aluminium compounds; coagulation; electronics industry; hydrogen compounds; industrial plants; industrial waste; wastewater treatment; Al2SO4; H2O2; H2SO4; Si; aluminum sulfate; cleaning; coagulant; hydrogen peroxide; semiconductor plant; silicon wafers; sulfuric acid; waste mixture; wastewater; Aluminum; Cleaning; Coagulation; Inorganic chemicals; Purification; Semiconductor device manufacture; Silicon; Slurries; Wastewater treatment; Water heating;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 2003 IEEE International Symposium on
  • ISSN
    1523-553X
  • Print_ISBN
    0-7803-7894-6
  • Type

    conf

  • DOI
    10.1109/ISSM.2003.1243218
  • Filename
    1243218
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2264291