• DocumentCode
    2264309
  • Title

    Energy and ultra-pure water consumption saving by the room temperature cleaning

  • Author

    Matsuo, Hiroshi ; Higuchi, Tatsuro ; Miyazaki, Koji

  • fYear
    2003
  • fDate
    30 Sept.-2 Oct. 2003
  • Firstpage
    6
  • Lastpage
    9
  • Abstract
    Energy-saving effect of a room temperature wet cleaning method using ozonated ultra-pure water is estimated in semiconductor manufacturing process. We can save 68% of electric energy and 33% of ultra-pure water consumption for each cleaning process in comparison with a conventional RCA cleaning. Total energy-saving effect using the room temperature cleaning method in front-end processes is 44% of electric and UPW generation energy. Electrical characteristics of gate oxide which is precleaned by using the room temperature wet cleaning method are equivalent for those by the conventional RCA cleaning.
  • Keywords
    cleaning; electronics industry; power consumption; semiconductor device manufacture; water conservation; water treatment; 293 to 298 K; H2O; UPW generation energy; electric energy; electrical properties; energy-saving; gate oxide; room temperature; semiconductor manufacturing; ultra pure water consumption; wet cleaning; Chemicals; Cities and towns; Cleaning; Electric variables; Electric variables measurement; Energy consumption; Manufacturing processes; Power measurement; Temperature; Ultrasonic variables measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 2003 IEEE International Symposium on
  • ISSN
    1523-553X
  • Print_ISBN
    0-7803-7894-6
  • Type

    conf

  • DOI
    10.1109/ISSM.2003.1243219
  • Filename
    1243219