Title :
5X capability improvement for 0.13 μm new product introductions
fDate :
30 Sept.-2 Oct. 2003
Abstract :
This paper describes the key strategies and systems that enabled a leading edge wafer fab to increase its 0.13 μm new product introduction (NPI) capability by 5x in less than 18 months without additional capital or headcount. For purposes of this paper, the NPI capability of the fab is defined as the rate at which the fab can deliver new product lots, or NPI´s. The specific strategies for delivering the increase involved simultaneously reducing the engineering content associated with an NPI and decreasing the throughput time (TPT) of NPI lots to world-class levels.
Keywords :
electronics industry; photolithography; product development; semiconductor device manufacture; 0.13 micron; 5X capability improvement; edge wafer fab; new product introductions; product development; throughput time; Computer industry; Consumer electronics; Current measurement; Demand forecasting; Electronics industry; Industrial electronics; Portfolios; Product development; Throughput; Velocity measurement;
Conference_Titel :
Semiconductor Manufacturing, 2003 IEEE International Symposium on
Print_ISBN :
0-7803-7894-6
DOI :
10.1109/ISSM.2003.1243228
