DocumentCode :
2264505
Title :
Lost utilization-constraint performance management
Author :
Devlin, P. ; Thielemier, C. ; Wehrlin, D.E.
Author_Institution :
Intel Corp., Colorado Springs, CO, USA
fYear :
2003
fDate :
30 Sept.-2 Oct. 2003
Firstpage :
51
Lastpage :
54
Abstract :
Increasing output at constraint toolsets can increase overall factory output. Although many companies might measures common metrics like utilization, availability, and output at constraints, it is difficult to decipher intelligence. This paper will focus on an indicator that pulls from common metrics to provide insight into constraint operations. By generating this data and applying common problem solving, all companies should be able to dramatically increase constraint tool performance. Reduction of gap between utilization and availability is a lever to increase execution performance at constraints. Understanding the lost utilization indicators will allow managers to know which tools should be running production and are not. This paper details an indicator that pulls together three common metrics (utilization, availability, and work in process {WIP}) to understand the manufacturing execution performance at constraint toolsets. This indicator provides managers, supervisors and technicians with the actionable data need to enhance constraint performance and increase output.
Keywords :
capacity planning (manufacturing); constraint theory; electronics industry; production management; semiconductor device manufacture; semiconductor device models; work in progress; WIP; constraint toolsets; decipher intelligence; indicator; manufacturing execution; metrics; overall factory output; utilization-constraint performance management; work in process; Availability; Capacity planning; Constraint theory; Costs; Manufacturing processes; Problem-solving; Production facilities; Qualifications; Semiconductor device manufacture; Springs;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing, 2003 IEEE International Symposium on
ISSN :
1523-553X
Print_ISBN :
0-7803-7894-6
Type :
conf
DOI :
10.1109/ISSM.2003.1243229
Filename :
1243229
Link To Document :
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