• DocumentCode
    2264676
  • Title

    Modeling of Digital Spectrum Based Ultrasonic Attenuation about Void Content in CFRP

  • Author

    Wu, Ruiming ; Jiang, Zhifeng ; Wu, Zuolun

  • Author_Institution
    Sch. of Mech. & Automotive Eng., Zhejiang Univ. of Sci. & Technol., Hangzhou
  • Volume
    2
  • fYear
    2008
  • fDate
    20-22 Dec. 2008
  • Firstpage
    459
  • Lastpage
    462
  • Abstract
    The voids morphological features are correlated with the CFRP porosity and the fraction of voids is nearly a logarithmic normal distribution with the voids´ size.The apparatus employed notebook computer to control signal´s collecting, processing, and displaying. Based on the method of acoustic resistance, this paper described the ultrasonic detection technology for bonded structures of composite materials on modern battleplan. The frequency-domain characteristics of echo can reveal some new information about the bonding defect, which were not evident in time domain.The experiments were performed using practical samples, and the results showed that defects in different samples can be quantitatively identified with high accuracy. Based on the study, an ultrasonic attenuation model of CFRP porosity testing was established in which the voids´ statistical and morphological features were considered.
  • Keywords
    carbon fibre reinforced plastics; composite materials; frequency-domain analysis; normal distribution; ultrasonic absorption; CFRP porosity; acoustic resistance; composite materials; digital spectrum; frequency-domain characteristics; logarithmic normal distribution; morphological features; notebook computer; ultrasonic attenuation; ultrasonic detection; void content; Acoustic signal detection; Attenuation; Bonding; Computer displays; Distributed computing; Gaussian distribution; Military computing; Process control; Signal processing; Size control; CFRP; Digital spectrum; Ultrasonic attenuation; Void content;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Intelligent Information Technology Application, 2008. IITA '08. Second International Symposium on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-0-7695-3497-8
  • Type

    conf

  • DOI
    10.1109/IITA.2008.310
  • Filename
    4739806