DocumentCode
2265109
Title
Investigation of high frequency coupling between probe tips and wafer surface
Author
Bazzi, J. ; Raya, C. ; Curutchet, A. ; Zimmer, T.
Author_Institution
Lab. de l´´integration du Materiau au Syst., Univ. Bordeaux, Talence, France
fYear
2009
fDate
12-14 Oct. 2009
Firstpage
87
Lastpage
90
Abstract
This paper presents an investigation of the coupling between probe tips and wafer surface through EM-simulation and compares the simulation results to measurements. It is pointed out that the results are very dependent on the adjacent structures lying under the probe tips. Different solutions are analyzed to master and/or reduce the coupling and ensure reproducibility.
Keywords
BiCMOS integrated circuits; S-parameters; integrated circuit measurement; probes; BiCMOS; EM-simulation; S-parameter measurement; high frequency coupling; probe tips; wafer surface; Frequency; Probes; EM simulation; HF coupling; S-parameter measurements;
fLanguage
English
Publisher
ieee
Conference_Titel
Bipolar/BiCMOS Circuits and Technology Meeting, 2009. BCTM 2009. IEEE
Conference_Location
Capri
ISSN
1088-9299
Print_ISBN
978-1-4244-4894-4
Electronic_ISBN
1088-9299
Type
conf
DOI
10.1109/BIPOL.2009.5314137
Filename
5314137
Link To Document