Title :
Investigation of high frequency coupling between probe tips and wafer surface
Author :
Bazzi, J. ; Raya, C. ; Curutchet, A. ; Zimmer, T.
Author_Institution :
Lab. de l´´integration du Materiau au Syst., Univ. Bordeaux, Talence, France
Abstract :
This paper presents an investigation of the coupling between probe tips and wafer surface through EM-simulation and compares the simulation results to measurements. It is pointed out that the results are very dependent on the adjacent structures lying under the probe tips. Different solutions are analyzed to master and/or reduce the coupling and ensure reproducibility.
Keywords :
BiCMOS integrated circuits; S-parameters; integrated circuit measurement; probes; BiCMOS; EM-simulation; S-parameter measurement; high frequency coupling; probe tips; wafer surface; Frequency; Probes; EM simulation; HF coupling; S-parameter measurements;
Conference_Titel :
Bipolar/BiCMOS Circuits and Technology Meeting, 2009. BCTM 2009. IEEE
Conference_Location :
Capri
Print_ISBN :
978-1-4244-4894-4
Electronic_ISBN :
1088-9299
DOI :
10.1109/BIPOL.2009.5314137
