Evaluation of Linux Bonding Features

Author

Aust, Stefan ; Kim, Jong-Ok ; Davis, Peter ; Yamaguchi, Akira ; Obana, Sadao

Author_Institution

Adaptive Commun. Res. Labs., ATR, Keihanna Science City

fYear

2006

fDate

27-30 Nov. 2006

Firstpage

1

Lastpage

6

Abstract

The paper contains an evaluation of the current Linux bonding implementation for wired interfaces. The Linux bonding provides methods to aggregate multiple wired interfaces to support load balancing, fault-tolerance and throughput improvement. The intention is to identify the performance of the current Linux bonding implementation and to use the results and assumptions for future discussions about bonding of wireless interfaces. The paper presents details about interface bonding in a RedHat Linux system and discusses measurement results of two bonded LAN interfaces using the round-robin bonding mode.

Keywords

Linux; fault tolerance; network interfaces; resource allocation; Linux bonding feature evaluation; RedHat Linux system; fault-tolerance; load balancing; multiple wired interfaces; round-robin bonding mode; throughput improvement; two bonded LAN interface; Bonding; Communication switching; Ethernet networks; Fault tolerance; Linux; Local area networks; Out of order; Personal communication networks; Switches; Throughput;

fLanguage

English

Publisher

ieee

Conference_Titel

Communication Technology, 2006. ICCT '06. International Conference on

Conference_Location

Guilin

Print_ISBN

1-4244-0800-8

Electronic_ISBN

1-4244-0801-6

Type

conf

DOI

10.1109/ICCT.2006.341935

Filename

4146536