Title :
Meta-framework for semantic TRIZ
Author :
Koswatte, Kowatte R. C. ; Incheon Paik ; Kumara, Banage T. G. S.
Author_Institution :
Sch. of Comput. Sci. & Eng., Univ. of Aizu, Aizu-Wakamatsu, Japan
Abstract :
In the manufacturing industry, SCM (Supply Chain Management) is playing an important role which gives profit to enterprise. Extracting innovative design considerations for a product from the information infrastructure requires large knowledge base and solutions to technical and physical contradictions. Construction of information infrastructure with the integration of four designs attributes: component cost, quality, function and technology, innovation can be enhanced. Information which is useful to improve the existing products and development of a new product can be acquired from the database and from the ontology. The TRIZ (Theory of Inventive Problem Solving) supports designers for innovative product design by searching from a knowledge base. The existing TRIZ ontology support innovative design of a product. But it is considering about a specific product (flashlight) for TRIZ ontology. Our final goal is to construct meta-TRIZ ontology that can be applied to multiple products. To achieve this goal, we try to apply the semantic TRIZ to another product; multifunction fan (Smart Fan), as an interim stage towards meta-ontology. This may open up new possibilities to innovative product designs with multifunction.
Keywords :
manufacturing industries; ontologies (artificial intelligence); problem solving; production engineering computing; supply chain management; SCM; innovative product design; manufacturing industry; meta-TRIZ ontology; meta-framework; product innovative design; semantic TRIZ; supply chain management; theory of inventive problem solving; Ontologies; Problem-solving; Product design; Semantics; Supply chain management; Supply chains; Technological innovation; Inventive Problem Solving; Ontology; Semantic Web; Supply Chain Management; TRIZ;
Conference_Titel :
Independent Computing (ISIC), 2014 IEEE International Symposium on
Conference_Location :
Orlando, FL
DOI :
10.1109/INDCOMP.2014.7011740