DocumentCode
2265614
Title
Reduction of PFCs emission by using FMAT gas as CVD chambers cleaning gas
Author
Yehezkel, G.
fYear
2003
fDate
30 Sept.-2 Oct. 2003
Firstpage
273
Lastpage
276
Abstract
PFC´s (Perfluorocompounds) are widely used for CVD chambers clean, and have been associated with damage to the environment-atmosphere due to their infrared absorbance and long decomposition time. PFC´s impact to the environment is considered so significant, that Intel Corp. has decided to replace current cleaning procedures using PFCs (C2F6). This paper describes the research and development of a new clean procedure for a CVD process tool by using FMAT (C4F8O) gas, which allows dramatic reduction in PFC emission (∼90%).
Keywords
chemical vapour deposition; cleaning; decomposition; infrared spectra; organic compounds; C4F8O gas; CVD chambers cleaning gas; current cleaning; decomposition time; dramatic reduction; environment-atmosphere; infrared absorbance; perfluorocarbon emission; Atmosphere; Chemical industry; Chemical processes; Chemical vapor deposition; Cleaning; Global warming; Infrared spectra; Noise measurement; Research and development; US Department of Energy;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 2003 IEEE International Symposium on
ISSN
1523-553X
Print_ISBN
0-7803-7894-6
Type
conf
DOI
10.1109/ISSM.2003.1243281
Filename
1243281
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