• DocumentCode
    2265617
  • Title

    An overview of the recent developments in high-voltage power semiconductor MOS-controlled bipolar devices

  • Author

    Ngwendson, L. ; Sweet, M.R. ; Narayanan, E. M Sankara

  • Author_Institution
    Electr. Machines & Drives Res. Group, Univ. of Sheffield, UK
  • fYear
    2009
  • fDate
    12-14 Oct. 2009
  • Firstpage
    198
  • Lastpage
    205
  • Abstract
    An overview of the recent developments in high-voltage power semiconductor MOS-controlled bipolar devices is presented. The insulated gate bipolar transistor (IGBT) technology is explored up to the latest state-of-the-art developments, in terms of cathode cell technology, drift region technology and anode design. MOS-gated thyristors, which are aimed to replace the IGBT are analysed. It is shown that in spite of the recent cathode cell developments to enhance the plasma distribution within the IGBT, a fully optimised MOS gated thyristor still remains the best approach to achieve enhanced Vce(sat) - Eoff trade-offs and negligible temperature coefficient of Vce(sat).
  • Keywords
    MIS devices; anodes; insulated gate bipolar transistors; thyristors; MOS-controlled bipolar devices; MOS-gated thyristors; anode design; cathode cell technology; drift region technology; high-voltage power semiconductor; insulated gate bipolar transistor; plasma distribution; Anodes; Bipolar transistors; Cathodes; Insulated gate bipolar transistors; MOSFET circuits; Plasma temperature; Power semiconductor devices; Switching loss; Thyristors; Voltage; CIGBT; Clustered IGBT; IGBT; MOS-gated Thyristor; TCIGBT;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Bipolar/BiCMOS Circuits and Technology Meeting, 2009. BCTM 2009. IEEE
  • Conference_Location
    Capri
  • ISSN
    1088-9299
  • Print_ISBN
    978-1-4244-4894-4
  • Electronic_ISBN
    1088-9299
  • Type

    conf

  • DOI
    10.1109/BIPOL.2009.5314159
  • Filename
    5314159