DocumentCode
2265617
Title
An overview of the recent developments in high-voltage power semiconductor MOS-controlled bipolar devices
Author
Ngwendson, L. ; Sweet, M.R. ; Narayanan, E. M Sankara
Author_Institution
Electr. Machines & Drives Res. Group, Univ. of Sheffield, UK
fYear
2009
fDate
12-14 Oct. 2009
Firstpage
198
Lastpage
205
Abstract
An overview of the recent developments in high-voltage power semiconductor MOS-controlled bipolar devices is presented. The insulated gate bipolar transistor (IGBT) technology is explored up to the latest state-of-the-art developments, in terms of cathode cell technology, drift region technology and anode design. MOS-gated thyristors, which are aimed to replace the IGBT are analysed. It is shown that in spite of the recent cathode cell developments to enhance the plasma distribution within the IGBT, a fully optimised MOS gated thyristor still remains the best approach to achieve enhanced Vce(sat) - Eoff trade-offs and negligible temperature coefficient of Vce(sat).
Keywords
MIS devices; anodes; insulated gate bipolar transistors; thyristors; MOS-controlled bipolar devices; MOS-gated thyristors; anode design; cathode cell technology; drift region technology; high-voltage power semiconductor; insulated gate bipolar transistor; plasma distribution; Anodes; Bipolar transistors; Cathodes; Insulated gate bipolar transistors; MOSFET circuits; Plasma temperature; Power semiconductor devices; Switching loss; Thyristors; Voltage; CIGBT; Clustered IGBT; IGBT; MOS-gated Thyristor; TCIGBT;
fLanguage
English
Publisher
ieee
Conference_Titel
Bipolar/BiCMOS Circuits and Technology Meeting, 2009. BCTM 2009. IEEE
Conference_Location
Capri
ISSN
1088-9299
Print_ISBN
978-1-4244-4894-4
Electronic_ISBN
1088-9299
Type
conf
DOI
10.1109/BIPOL.2009.5314159
Filename
5314159
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