Throughput analysis for cluster tool under transfer bound condition and its application to dry etch equipment

Author

Jung Hyun Cho ; Sun Joong Ryu ; Seung-Ki Chae

Author_Institution

Samsung Electron. Co. Ltd., Gyeonggi-Do, South Korea

fYear

2003

fDate

30 Sept.-2 Oct. 2003

Firstpage

289

Lastpage

292

Abstract

When a cluster tool is in a state of transfer bound condition small changes of the wafer transfer time could cause large throughput variation of cluster tool. In our memory device fabrication line, The throughput variation between the equipment reached up to 32%. Based on the results of the cluster tool simulation, several parameters of the equipments were found to have a severe impact on the throughput variation of the equipment. The parameters of the equipment could be modified adequately. In addition, the wafer transfer time could be successfully reduced. As a result, throughput variation of the equipments was improved successfully.

Keywords

cluster tools; electronics industry; integrated circuit manufacture; integrated circuit modelling; integrated memory circuits; monolithic integrated circuits; production planning; sputter etching; cluster tool simulation; dry etch equipment; memory device fabrication; throughput analysis; transfer bound condition; wafer transfer; Blades; Discrete event systems; Dry etching; Fabrication; Robots; Semiconductor device modeling; Sun; Throughput;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing, 2003 IEEE International Symposium on

ISSN

1523-553X

Print_ISBN

0-7803-7894-6

Type

conf

DOI

10.1109/ISSM.2003.1243284

Filename

1243284