DocumentCode
2265871
Title
An asynchronously embedded datapath for performance acceleration and energy efficiency
Author
Marr, Bo ; Degnan, Brian ; Hasler, Paul ; Anderson, David V.
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2009
fDate
24-27 May 2009
Firstpage
3046
Lastpage
3049
Abstract
Motivated by the unwillingness to accept the worst-case timing constraint that synchronous logic imposes, and additionally motivated by finding a supply voltage scaling scheme for datapath circuits that is unconstrained by timing errors in memory elements, the authors have built an asynchronous datapath that is embedded seamlessly into a synchronous register file. This paper will show that not only does asynchronous arithmetic logic exhibit many characteristics that allow it to be inherently lower power, but it is significantly faster than any synchronous counterpart and is a perfect candidate technology for datapath acceleration. Further, novel circuits are presented that allow asynchronous datapath units to be embedded in a synchronous environment with little overhead while the dual-rail asynchronous encoding scheme is successfully converted with equally low overhead. The authors have built a test chip being fabricated at the time of publication. The circuits on this chip will be discussed and simulation results given showing this design to be both energy and performance efficient when compared to other known datapath designs.
Keywords
logic circuits; timing circuits; asynchronously embedded datapath; datapath circuits; dual-rail asynchronous encoding scheme; energy efficiency; memory elements; performance acceleration; supply voltage scaling scheme; synchronous logic; synchronous register file; worst-case timing constraint; Acceleration; Arithmetic; Circuit simulation; Circuit testing; Encoding; Energy efficiency; Logic circuits; Registers; Timing; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 2009. ISCAS 2009. IEEE International Symposium on
Conference_Location
Taipei
Print_ISBN
978-1-4244-3827-3
Electronic_ISBN
978-1-4244-3828-0
Type
conf
DOI
10.1109/ISCAS.2009.5118445
Filename
5118445
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