DocumentCode
2265963
Title
Nondestructive monitoring of CMP pad surface
Author
Nagai, Shuichi ; Fujishima, Tatsuya ; Sameshima, K.
Author_Institution
Halca Project, Assoc. of Super-Adv. Electron. Technol., Tsukuba, Japan
fYear
2003
fDate
30 Sept.-2 Oct. 2003
Firstpage
343
Lastpage
346
Abstract
A pad condition significantly affects the polishing performance of CMP, so that a control of the pad surface condition is so important. In this paper, we propose a monitoring technology of a pad surface using laser focus displacement meter to control the pad condition based on correlation of a polishing rate with a roughness of pad surface.
Keywords
chemical mechanical polishing; nondestructive testing; process monitoring; semiconductor materials; surface roughness; CMP pad surface; chemical mechanical polishing; monitoring technology; nondestructive monitoring; pad surface roughness; Atherosclerosis; Charge coupled devices; Charge-coupled image sensors; Chemical technology; Condition monitoring; Laser feedback; Rough surfaces; Scanning electron microscopy; Surface emitting lasers; Surface roughness;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 2003 IEEE International Symposium on
ISSN
1523-553X
Print_ISBN
0-7803-7894-6
Type
conf
DOI
10.1109/ISSM.2003.1243297
Filename
1243297
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