DocumentCode
2266401
Title
Intelligent sample test using cost based methodologies
Author
Shumaker, J. ; Phillips, Andrew ; Lauderdale, M.
Author_Institution
Motorola Inc., Austin, TX, USA
fYear
2003
fDate
30 Sept.-2 Oct. 2003
Firstpage
439
Lastpage
442
Abstract
In today´s vertically integrated semiconductor companies, the entire manufacturing process impacts the product´s bottom line. Wafer test was designed to eliminate expensive assembly of bad die. Wafer test costs are becoming high so time spent testing is less cost effective. Sample testing is a technique for lowering wafer test costs. Careful tuning can optimize the process. This paper introduces a method for sample candidate selection, test plan creation as well as cost model validation. We specifically discuss an extensible solution developed at Motorola to avoid capital investment in automated test equipment. The result is a permanent increase in test floor throughput with no increase in hardware.
Keywords
automatic test equipment; integrated circuit economics; integrated circuit manufacture; integrated circuit testing; automated test equipment; hardware; integrated semiconductor company; intelligent sample test; manufacturing process; time spent testing; wafer test; Assembly; Costs; Investments; Manufacturing processes; Packaging; Probes; Sampling methods; Test equipment; Testing; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 2003 IEEE International Symposium on
ISSN
1523-553X
Print_ISBN
0-7803-7894-6
Type
conf
DOI
10.1109/ISSM.2003.1243321
Filename
1243321
Link To Document