• DocumentCode
    2266401
  • Title

    Intelligent sample test using cost based methodologies

  • Author

    Shumaker, J. ; Phillips, Andrew ; Lauderdale, M.

  • Author_Institution
    Motorola Inc., Austin, TX, USA
  • fYear
    2003
  • fDate
    30 Sept.-2 Oct. 2003
  • Firstpage
    439
  • Lastpage
    442
  • Abstract
    In today´s vertically integrated semiconductor companies, the entire manufacturing process impacts the product´s bottom line. Wafer test was designed to eliminate expensive assembly of bad die. Wafer test costs are becoming high so time spent testing is less cost effective. Sample testing is a technique for lowering wafer test costs. Careful tuning can optimize the process. This paper introduces a method for sample candidate selection, test plan creation as well as cost model validation. We specifically discuss an extensible solution developed at Motorola to avoid capital investment in automated test equipment. The result is a permanent increase in test floor throughput with no increase in hardware.
  • Keywords
    automatic test equipment; integrated circuit economics; integrated circuit manufacture; integrated circuit testing; automated test equipment; hardware; integrated semiconductor company; intelligent sample test; manufacturing process; time spent testing; wafer test; Assembly; Costs; Investments; Manufacturing processes; Packaging; Probes; Sampling methods; Test equipment; Testing; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 2003 IEEE International Symposium on
  • ISSN
    1523-553X
  • Print_ISBN
    0-7803-7894-6
  • Type

    conf

  • DOI
    10.1109/ISSM.2003.1243321
  • Filename
    1243321