300 mm one-way front opening shipping box

Author

Howell, R.

fYear

2003

fDate

30 Sept.-2 Oct. 2003

Firstpage

443

Lastpage

446

Abstract

Supply chain and management of a re-usable 300 mm wafer-carrier shipping model for semiconductor high-volume manufacturing was identified as a significant cost savings opportunity for Intel. Breakthrough design and manufacture of a thermoformed, SEMI-compliant, one-way disposable 300mm wafer shipping carrier, codenamed "1WFOSB," has been accomplished. A 1WFOSB model eliminates empty overseas wafer-carrier shipping and associated return-supply chain costs, with a reduced price of 25-50% over a wide range of today\´s wafer carrier solutions. Overviews of unique design, manufacturing, critical attribute conformance, testing techniques and preliminary testing results are presented. Indicators for successful performance and continued challenges are highlighted. Realization of 1WFOSB benefits includes lower cost of ownership through utilization of a one-way carrier shipping model, eliminating return supply-chain costs, lowering unit price, and improving shipping protection performance.

Keywords

integrated circuit economics; integrated circuit manufacture; integrated circuit packaging; integrated circuit testing; packaging; 1WFOSB model; 300 mm; breakthrough design; one way front opening shipping box; return supply chain; semiconductor high volume manufacture; shipping protection performance; testing techniques; wafer carrier shipping model; wafer carrier solutions; Assembly; Costs; Logic testing; Polyethylene; Semiconductor device manufacture; Semiconductor device modeling; Supply chain management; Supply chains; Thermoforming; Virtual manufacturing;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing, 2003 IEEE International Symposium on

ISSN

1523-553X

Print_ISBN

0-7803-7894-6

Type

conf

DOI

10.1109/ISSM.2003.1243322

Filename

1243322