• DocumentCode
    2266888
  • Title

    Fault isolation and performance characterization of high speed digital multichip modules

  • Author

    Keezer, D.C.

  • Author_Institution
    Center for Microelectron. Res., Univ. of South Florida, Tampa, FL, USA
  • fYear
    1995
  • fDate
    31 Jan-2 Feb 1995
  • Firstpage
    26
  • Lastpage
    31
  • Abstract
    This paper describes two methods for testing high performance digital multichip modules (MCMs). The first technique provides a method for multiplexing automatic test system channels so that clock and data rates can be extended beyond the normal frequency limits of the Automatic Test Equipment (ATE). The multiplexing method has been successfully applied at rates up to 1.6 GHz using 200 MHz ATE. The second approach utilizes an electron beam probe system operating in the voltage contrast mode to measure electrical signals within the MCM. The e-beam probe can be used to supplement scan-based techniques for isolating faults. It can also be used for characterizing signal quality (rise-time, overshoot, crosstalk, reflections) and measurement of relative delays in high performance MCMs
  • Keywords
    UHF measurement; automatic test equipment; automatic testing; crosstalk; delays; digital integrated circuits; electron beam testing; fault location; integrated circuit testing; multichip modules; multiplexing; 1.6 GHz; 200 MHz; ATE channels multiplexing; MCM testing; automatic test system channels; clock rates; crosstalk; data rates; e-beam probe; electron beam probe system; fault isolation; high speed digital MCM; multichip modules; overshoot; performance characterization; reflections; relative delays; rise-time; scan-based techniques; signal quality; voltage contrast mode; Automatic test equipment; Automatic testing; Clocks; Electron beams; Frequency; Multichip modules; Multiplexing equipment; Probes; System testing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multi-Chip Module Conference, 1995. MCMC-95, Proceedings., 1995 IEEE
  • Conference_Location
    Santa Cruz, CA
  • Print_ISBN
    0-8186-6970-5
  • Type

    conf

  • DOI
    10.1109/MCMC.1995.511999
  • Filename
    511999