Electrical and thermal study of membrane multi-chip module systems

Author

Cheng, Wheling ; Wong, Simon S.

Author_Institution

Center for Integrated Syst., Stanford Univ., CA, USA

fYear

1995

fDate

31 Jan-2 Feb 1995

Firstpage

69

Lastpage

74

Abstract

Membrane multi-chip modules (MCMs) have been fabricated to investigate both the electrical design and thermal management of advanced MCM systems. Custom bipolar interface circuits have been interconnected to CMOS VLSI chips, achieving a chip-to-chip delay of 5.6 nsec compared with 7.9 nsec for wire bonded system. Integrated decoupling capacitors and bipolar transistors were utilized to reduce power supply noise across chips by a factor of 3.2. To further decrease the thermal resistance of the systems, water has been used to provide extra heat removal paths. The thermal resistance of the systems has been decreased from 25°C/W to 17°C/W with the sealed water

Keywords

CMOS integrated circuits; VLSI; application specific integrated circuits; bipolar integrated circuits; integrated circuit noise; membranes; multichip modules; thermal resistance; 5.6 ns; CMOS VLSI chips; bipolar transistors; chip-to-chip delay; custom bipolar interface circuits; electrical design; heat removal; integrated decoupling capacitors; membrane multi-chip module; power supply noise; sealed water; thermal management; thermal resistance; Biomembranes; Bonding; Delay; Integrated circuit interconnections; Power system interconnection; Power system management; Thermal management; Thermal resistance; Very large scale integration; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Multi-Chip Module Conference, 1995. MCMC-95, Proceedings., 1995 IEEE

Conference_Location

Santa Cruz, CA

Print_ISBN

0-8186-6970-5

Type

conf

DOI

10.1109/MCMC.1995.512006

Filename

512006