DocumentCode
2267053
Title
Thermosonic bonding for flip-chip assembly
Author
Kang, Sa Yoon ; McLaren, Timothy ; Zhang, Wenge ; Lee, Y.C.
Author_Institution
Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA
fYear
1995
fDate
31 Jan-2 Feb 1995
Firstpage
75
Lastpage
80
Abstract
Thermosonic flip-chip bonding is a new, solderless technology for area-array connections. Its simple, clean, and dry process may significantly reduce the assembly cost for prototyping and manufacturing of MCMs. The feasibility of the technology has been demonstrated by our studies on 64-I/O GaAs-on-silicon test vehicles. But, the repeatability of the bonding quality needs to be controlled. Two process control variables, force and ultrasonic power applied to the chip, will be discussed
Keywords
flip-chip devices; lead bonding; multichip modules; GaAs-Si; GaAs-on-silicon test vehicles; MCMs; area-array connections; cost; dry proces; flip-chip assembly; force; manufacturing; process control; prototyping; solderless technology; thermosonic bonding; ultrasonic power; Assembly; Bonding; Costs; Force control; Gold; Packaging; Process control; Prototypes; Testing; Vehicles;
fLanguage
English
Publisher
ieee
Conference_Titel
Multi-Chip Module Conference, 1995. MCMC-95, Proceedings., 1995 IEEE
Conference_Location
Santa Cruz, CA
Print_ISBN
0-8186-6970-5
Type
conf
DOI
10.1109/MCMC.1995.512007
Filename
512007
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