• DocumentCode
    2267106
  • Title

    Electromagnetic modeling and transient simulation of interconnects in high speed VLSI

  • Author

    Zhu, Zhen-Hai ; Hong, Wei ; Chen, Yiyuan ; Wang, Yunyi ; Tao, Jin

  • Author_Institution
    Dept. of Radio Eng., Southeast Univ., Nanjing, China
  • fYear
    1995
  • fDate
    31 Jan-2 Feb 1995
  • Firstpage
    93
  • Lastpage
    98
  • Abstract
    A new technique is implemented in the method of lines to calculate the static parameters of a multilayered multiconductor system. Every dielectric layer is equivalent to a transmission line and every interface with conductors is equivalent to a current source, thus the whole structure is equivalent to a series of cascading two port networks. A bilevel waveform relaxation method is then used to compute the transient response of such a system terminated in arbitrary loads. All these are integrated into a software specially for the interconnect problems and one of its typical applications is presented
  • Keywords
    VLSI; circuit analysis computing; digital simulation; equivalent circuits; integrated circuit interconnections; integrated circuit packaging; iterative methods; multichip modules; transient analysis; transient response; IC interconnects; arbitrary loads; bilevel waveform relaxation method; cascading two port network equivalent; electromagnetic modeling; high speed VLSI; method of lines; multilayered multiconductor system; static parameters; transient response; transient simulation; Clocks; Conductors; Dielectric losses; Dielectric substrates; Electromagnetic modeling; Electromagnetic transients; Integrated circuit interconnections; Message-oriented middleware; Printed circuits; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multi-Chip Module Conference, 1995. MCMC-95, Proceedings., 1995 IEEE
  • Conference_Location
    Santa Cruz, CA
  • Print_ISBN
    0-8186-6970-5
  • Type

    conf

  • DOI
    10.1109/MCMC.1995.512010
  • Filename
    512010