DocumentCode
2267106
Title
Electromagnetic modeling and transient simulation of interconnects in high speed VLSI
Author
Zhu, Zhen-Hai ; Hong, Wei ; Chen, Yiyuan ; Wang, Yunyi ; Tao, Jin
Author_Institution
Dept. of Radio Eng., Southeast Univ., Nanjing, China
fYear
1995
fDate
31 Jan-2 Feb 1995
Firstpage
93
Lastpage
98
Abstract
A new technique is implemented in the method of lines to calculate the static parameters of a multilayered multiconductor system. Every dielectric layer is equivalent to a transmission line and every interface with conductors is equivalent to a current source, thus the whole structure is equivalent to a series of cascading two port networks. A bilevel waveform relaxation method is then used to compute the transient response of such a system terminated in arbitrary loads. All these are integrated into a software specially for the interconnect problems and one of its typical applications is presented
Keywords
VLSI; circuit analysis computing; digital simulation; equivalent circuits; integrated circuit interconnections; integrated circuit packaging; iterative methods; multichip modules; transient analysis; transient response; IC interconnects; arbitrary loads; bilevel waveform relaxation method; cascading two port network equivalent; electromagnetic modeling; high speed VLSI; method of lines; multilayered multiconductor system; static parameters; transient response; transient simulation; Clocks; Conductors; Dielectric losses; Dielectric substrates; Electromagnetic modeling; Electromagnetic transients; Integrated circuit interconnections; Message-oriented middleware; Printed circuits; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Multi-Chip Module Conference, 1995. MCMC-95, Proceedings., 1995 IEEE
Conference_Location
Santa Cruz, CA
Print_ISBN
0-8186-6970-5
Type
conf
DOI
10.1109/MCMC.1995.512010
Filename
512010
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