DocumentCode
2267112
Title
Providing a High-Performance VIA-Module for LAM/MPI
Author
Mehlan, Torsten ; Rehm, Wolfgang ; Engler, Ralph ; Wenzel, Tobias
Author_Institution
Chemnitz University of Technology, Germany
fYear
2004
fDate
7-10 Sept. 2004
Firstpage
277
Lastpage
282
Abstract
The Virtual Interface Architecture (VIA) was introduced to define a common set of features that are suitable to build high-speed networks. Today the interface of VIA serves as access point to a wide range of system area networks. M-VIA is a software that provides the VIA interface on top of several Ethernet cards. The overhead of TCP/IP protocols is avoided by running M-VIA. To benefit from this performance we developed a LAM/MPI module that utilizes VIA functions to transmit data. The key concepts of data transmission and memory management are presented by this paper. Furthermore a comparative performance analysis is included.
Keywords
Access protocols; Chemical technology; Computer architecture; Computer science; Data communication; Data structures; Economic indicators; Ethernet networks; Open source software; TCPIP;
fLanguage
English
Publisher
ieee
Conference_Titel
Parallel Computing in Electrical Engineering, 2004. PARELEC 2004. International Conference on
Print_ISBN
0-7695-2080-4
Type
conf
DOI
10.1109/PCEE.2004.59
Filename
1376769
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