Title :
Avoiding dispersion in distributed RLC lines by shaping
Author :
Roychowdhury, Jaijeet S.
Author_Institution :
AT&T Bell Labs., Allentown, PA, USA
fDate :
31 Jan-2 Feb 1995
Abstract :
The shaping of RLC lines for delay reduction is investigated. It is shown that inductance can act to diminish dispersion, to the extent of reducing delay to its theoretical time-of-flight minimum even in the presence of substantial loss in the line. Simulations predict significant delay improvement (25%-38%) for long MCM lines propagating high-speed signals
Keywords :
delays; inductance; integrated circuit interconnections; multichip modules; delay reduction; distributed RLC lines; high-speed signals; inductance; line shaping; long MCM lines; time-of-flight minimum; Capacitance; Circuits; Delay effects; Delay lines; Distortion measurement; Harmonic distortion; Inductance; Predictive models; Propagation delay; Wires;
Conference_Titel :
Multi-Chip Module Conference, 1995. MCMC-95, Proceedings., 1995 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-6970-5
DOI :
10.1109/MCMC.1995.512013
