Title :
A novel low cost MCM-D technology
Author :
Almeida ; Barnett, A.M. ; Finardi, M. ; Flacker, C.A. ; Gozzi, Antonio C. ; Molina, Jose P. ; Pagotto, A.C. ; Santos, Manuel Filipe
Author_Institution :
Res. & Dev. Cente, Telecomunicacoes Brasileiras SA, Campinas, Brazil
fDate :
31 Jan-2 Feb 1995
Abstract :
Interconnection technology has also been a key to success in the modern telecommunication systems, which are demanding more and more services, mobility, and reliability. As one knows, different technologies has been applied to solve the needs on electronic packaging, each one with its advantages and disadvantages. Telebras has evaluated them and decided to investigate an own solution. The paper describes a technological solution for fabricating MCMs developed at Telebras. It presents as main features: low cost, process simplification, reproducibility and SMD and COB assembly compatibility. This innovative approach is based on a electro-chemical copper deposition onto ceramics and conventional lithography. A general description of the processing is provided and some results and modules fabricated on alumina 96% are shown
Keywords :
electrodeposition; lithography; multichip modules; Al2O3; COB assembly; Cu; MCM-D; SMD assembly; Telebras; alumina; ceramics; electro-chemical copper deposition; electronic packaging; interconnection technology; lithography; low cost fabrication; telecommunication system; Assembly; Ceramics; Conducting materials; Costs; Lithography; Manufacturing industries; Substrates; Surface cleaning; Telecommunications; Thick films;
Conference_Titel :
Multi-Chip Module Conference, 1995. MCMC-95, Proceedings., 1995 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-6970-5
DOI :
10.1109/MCMC.1995.512022
