DocumentCode
2267503
Title
Experimental characterization of simultaneous switching noise for multichip module
Author
Ito, Kenji ; Kato, Katsuto ; Hirano, Naohiko ; Sudo, Toshio
Author_Institution
Semicond. Device Eng. Lab., Toshiba Corp., Kawasaki, Japan
fYear
1995
fDate
31 Jan-2 Feb 1995
Firstpage
217
Lastpage
220
Abstract
CMOS-based multichip modules have been actively developed for achieving high performance and high speed systems. Simultaneous switching noise (SSN) induced by CMOS output buffers is a serious issue in multichip modules as well as single-chip packages to ensure stable operation and to derive inherent speed performance. Multichip modules are expected to have smaller switching noise level than the case of single-chip packages by removing a first-level package and its parasitics. This paper reports the measurement results of switching noises for different types of MCMs using a switching noise generating chip. Two types of test vehicles were fabricated and measurement results were compared. Noise distribution on a ground plane was also measured
Keywords
CMOS digital integrated circuits; electric noise measurement; integrated circuit noise; integrated circuit testing; multichip modules; noise measurement; switching; CMOS output buffers; CMOS-based MCMs; ground plane noise distribution; multichip module; simultaneous switching noise; switching noise generating chip; Ceramics; Circuit testing; Dielectric substrates; Multichip modules; Noise generators; Noise measurement; Packaging; Semiconductor device measurement; Semiconductor device noise; Vehicles;
fLanguage
English
Publisher
ieee
Conference_Titel
Multi-Chip Module Conference, 1995. MCMC-95, Proceedings., 1995 IEEE
Conference_Location
Santa Cruz, CA
Print_ISBN
0-8186-6970-5
Type
conf
DOI
10.1109/MCMC.1995.512030
Filename
512030
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