Title :
Experimental characterization of simultaneous switching noise for multichip module
Author :
Ito, Kenji ; Kato, Katsuto ; Hirano, Naohiko ; Sudo, Toshio
Author_Institution :
Semicond. Device Eng. Lab., Toshiba Corp., Kawasaki, Japan
fDate :
31 Jan-2 Feb 1995
Abstract :
CMOS-based multichip modules have been actively developed for achieving high performance and high speed systems. Simultaneous switching noise (SSN) induced by CMOS output buffers is a serious issue in multichip modules as well as single-chip packages to ensure stable operation and to derive inherent speed performance. Multichip modules are expected to have smaller switching noise level than the case of single-chip packages by removing a first-level package and its parasitics. This paper reports the measurement results of switching noises for different types of MCMs using a switching noise generating chip. Two types of test vehicles were fabricated and measurement results were compared. Noise distribution on a ground plane was also measured
Keywords :
CMOS digital integrated circuits; electric noise measurement; integrated circuit noise; integrated circuit testing; multichip modules; noise measurement; switching; CMOS output buffers; CMOS-based MCMs; ground plane noise distribution; multichip module; simultaneous switching noise; switching noise generating chip; Ceramics; Circuit testing; Dielectric substrates; Multichip modules; Noise generators; Noise measurement; Packaging; Semiconductor device measurement; Semiconductor device noise; Vehicles;
Conference_Titel :
Multi-Chip Module Conference, 1995. MCMC-95, Proceedings., 1995 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-6970-5
DOI :
10.1109/MCMC.1995.512030