On-chip assembly of silicon photonic band gap crystals

Author

Vlasov, Yu.A. ; Norris, David J. ; Bo, X.Z. ; Sturm, James C.

Author_Institution

NEC Res. Inst., Princeton, NJ, USA

fYear

2002

fDate

24-24 May 2002

Firstpage

300

Abstract

Summary from only given. Three-dimensional silicon photonic band gap crystals are obtained by combining planar self-assembly of colloidal spheres with standard silicon deposition techniques. This simple and inexpensive approach, which is compatible with conventional microelectronics fabrication, yields high refractive- index inverted opals of controllable thickness that are integrated directly onto a silicon wafer. These photonic bandgap structures, which operate at telecommunications wavelengths, are planar single-crystals over large areas with very low defect densities.

Keywords

colloids; crystal defects; optical fabrication; photonic band gap; photonic crystals; refractive index; self-assembly; silicon; 3D silicon photonic band gap crystals; Si; colloidal spheres; controllable thickness; high refractive-index inverted opals; integrated directly; low defect densities; microelectronics fabrication; photonic bandgap structures; planar self-assembly; planar single-crystals; standard silicon deposition techniques; telecommunications wavelengths; Assembly; Colloidal crystals; Fabrication; Microelectronics; Optical refraction; Photonic band gap; Photonic crystals; Self-assembly; Silicon; Thickness control;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics, 2002. CLEO '02. Technical Digest. Summaries of Papers Presented at the

Conference_Location

Long Beach, CA, USA

Print_ISBN

1-55752-706-7

Type

conf

DOI

10.1109/CLEO.2002.1034002

Filename

1034002