Thermal characterisation of vertical multichip modules MCM-V

Author

Cahill, C. ; Compagno, T. ; Donovan, J. O´ ; Slattery, O. ; Mathuna, C. O´ ; Barrett, J. ; Drouhin, I. ; Val, C. ; Tigneres, J.P. ; Stern, J. ; Ivey, P. ; Masgrangeas, M. ; Coello-Vera, A.

Author_Institution

Nat. Microelectron. Res. Centre, Univ. Coll. Cork, Ireland

fYear

1995

fDate

7-9 Feb 1995

Firstpage

10

Lastpage

16

Abstract

This paper describes the thermal characterisation of a vertical multichip module (MCM-V) technology. The MCM-V technology encloses a stack of ICs in a three dimensional cube of plastic moulding compound with the inter-chip electrical connections made on the outside faces of the cube. Steady state and transient thermal results are presented. Thermal measurements were carried out on modules containing eight specially designed package evaluation test chips. Simulation results are shown for two applications manufactured in the MCM-V technology; a 2 W 16 chip 256 MBit DRAM module and a 3 W 9 chip image processing system

Keywords

automatic testing; integrated circuit packaging; multichip modules; plastic packaging; thermal resistance; transient analysis; 2 W; 3 W; DRAM module; MCM-V; image processing system; inter-chip electrical connections; package evaluation test chips; plastic moulding compound; steady state thermal results; thermal characterisation; three dimensional cube; transient thermal results; vertical multichip modules; Electronic packaging thermal management; Image processing; Multichip modules; Plastics; Power dissipation; Semiconductor device measurement; Testing; Thermal conductivity; Virtual manufacturing; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 1995. SEMI-THERM XI., Eleventh Annual IEEE

Conference_Location

San Jose, CA

ISSN

1065-2221

Print_ISBN

0-7803-2434-X

Type

conf

DOI

10.1109/STHERM.1995.512045

Filename

512045