A study of chip thermal crosstalk in plastic VLSI packages

Plastic VLSI packages are modeled as five-layer structure. Lateral boundaries are assumed to extend to infinity for a planar reference structure. With a small heat source on the silicon chip, calculation results show that the temperature profile on the chip decreases exponentially for distance greater than a specific value. An empirical temperature expression is thus established. The expression enables efficient calculation of temperatures at remote locations. These temperatures are important for large chip devices having large number of small heat sources