DocumentCode :
2267729
Title :
Optimum design and selection of heat sinks
Author :
Lee, Seri
Author_Institution :
Aavid Eng. Inc., Laconia, NH, USA
fYear :
1995
fDate :
7-9 Feb 1995
Firstpage :
48
Lastpage :
54
Abstract :
An analytical simulation model has been developed for predicting and optimizing the thermal performance of bidirectional fin heat sinks in a partially confined configuration. Sample calculations are carried out, and parametric plots are provided, illustrating the effect of various design parameters on the performance of a heat sink. It is observed that the actual convection flow velocity through fins is usually unknown to designers, yet, is one of the parameters that greatly affect the overall thermal performance of a heat sink. In this paper, a simple method of determining the fin flow velocity is presented, and the development of the overall thermal model is described. An overview of different types of heat sinks and associated design parameters is provided. Optimization of heat-sink designs and typical parametric behaviors are discussed based on the sample simulation results
Keywords :
cooling; forced convection; heat sinks; integrated circuit packaging; natural convection; optimisation; analytical simulation model; bidirectional fin heat sinks; convection flow velocity; design parameters; fin flow velocity; overall thermal model; overall thermal performance; parametric plots; partially confined configuration; thermal performance; Analytical models; Channel spacing; Coolants; Cost function; Design optimization; Equations; Heat sinks; Manufacturing; Performance analysis; Predictive models;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1995. SEMI-THERM XI., Eleventh Annual IEEE
Conference_Location :
San Jose, CA
ISSN :
1065-2221
Print_ISBN :
0-7803-2434-X
Type :
conf
DOI :
10.1109/STHERM.1995.512051
Filename :
512051
Link To Document :
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