Optimum design and selection of heat sinks

Author

Lee, Seri

Author_Institution

Aavid Eng. Inc., Laconia, NH, USA

fYear

1995

fDate

7-9 Feb 1995

Firstpage

48

Lastpage

54

Abstract

An analytical simulation model has been developed for predicting and optimizing the thermal performance of bidirectional fin heat sinks in a partially confined configuration. Sample calculations are carried out, and parametric plots are provided, illustrating the effect of various design parameters on the performance of a heat sink. It is observed that the actual convection flow velocity through fins is usually unknown to designers, yet, is one of the parameters that greatly affect the overall thermal performance of a heat sink. In this paper, a simple method of determining the fin flow velocity is presented, and the development of the overall thermal model is described. An overview of different types of heat sinks and associated design parameters is provided. Optimization of heat-sink designs and typical parametric behaviors are discussed based on the sample simulation results

Keywords

cooling; forced convection; heat sinks; integrated circuit packaging; natural convection; optimisation; analytical simulation model; bidirectional fin heat sinks; convection flow velocity; design parameters; fin flow velocity; overall thermal model; overall thermal performance; parametric plots; partially confined configuration; thermal performance; Analytical models; Channel spacing; Coolants; Cost function; Design optimization; Equations; Heat sinks; Manufacturing; Performance analysis; Predictive models;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 1995. SEMI-THERM XI., Eleventh Annual IEEE

Conference_Location

San Jose, CA

ISSN

1065-2221

Print_ISBN

0-7803-2434-X

Type

conf

DOI

10.1109/STHERM.1995.512051

Filename

512051