Thermal transient characterization of electronic assemblies by infrared thermography and Delta Vbemeter methods

Author

Dondon, P.H. ; Woirgard, E. ; Zardini, Ch

Author_Institution

IX, Talence, France

fYear

1995

fDate

7-9 Feb 1995

Firstpage

87

Lastpage

91

Abstract

The severe operating environment of electronic systems, means that the design of electronic boards requires continual investigations, involving not only electronics but also thermal and thermomechanical studies. We present here two complementary experimental methods to characterize the thermal transient behaviour of electronic assemblies and we compare the results obtained. Then, we conclude by presenting the fields of applications for such test equipment

Keywords

automatic test equipment; infrared imaging; packaging; temperature distribution; temperature measurement; thermal analysis; Delta Vbemeter methods; IR method; electronic assemblies; infrared thermography; severe operating environment; test equipment; thermal transient characterization; Assembly; Microelectronics; Performance evaluation; Pulse measurements; Temperature sensors; Testing; Thermal conductivity; Thermal resistance; Transient analysis; Vehicles;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 1995. SEMI-THERM XI., Eleventh Annual IEEE

Conference_Location

San Jose, CA

ISSN

1065-2221

Print_ISBN

0-7803-2434-X

Type

conf

DOI

10.1109/STHERM.1995.512057

Filename

512057