• DocumentCode
    2267876
  • Title

    Semicustom design of ASICs: silicon chips-versus-FPGAs for engineering education

  • Author

    Abdel-Aty-Zohdy, Hoda S. ; Jozefowicz, Paul A.

  • Author_Institution
    Dept. of Electr. & Syst. Eng., Oakland Univ., Rochester, MI, USA
  • fYear
    1993
  • fDate
    16-18 Aug 1993
  • Firstpage
    1548
  • Abstract
    Application Specific Integrated Circuits (ASICs) implementation is a definite move forward in large-scale electronics. ASICs offer better yield, life time, performance, as well as reliability as compared to traditional hybrid circuits. Effective use of Electronics Design Automation Tools (EDAT) is essential for successful ASICs. Also, the use of EDATs is expected to narrow the gap between the academia and industry. Thus, future graduating engineers would make effective contributions to the vastly developing electronics, national and international market. This paper compares the necessary background and the advantages of two alternatives for implementing semicustom design of ASICs; semicustom silicon chips, and Field Programmable Gate Arrays (FPGAs). An 8×8 multiplier design example is used as illustration. The feasibility, accessibility and rewards of such educational experiences are also addressed
  • Keywords
    application specific integrated circuits; circuit CAD; electronic engineering education; field programmable gate arrays; integrated circuit design; logic CAD; programmable logic arrays; silicon; ASIC design; FPGAs; Si chips; application specific integrated circuits; electronics design automation tools; engineering education; field programmable gate arrays; semicustom design; Application specific integrated circuits; Consumer electronics; Design engineering; Engineering education; Field programmable gate arrays; Laboratories; Large scale integration; Large-scale systems; Reliability engineering; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 1993., Proceedings of the 36th Midwest Symposium on
  • Conference_Location
    Detroit, MI
  • Print_ISBN
    0-7803-1760-2
  • Type

    conf

  • DOI
    10.1109/MWSCAS.1993.343411
  • Filename
    343411