Title :
Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)
Abstract :
The following topics were dealt with: thermal characterization, modeling and analysis, and thermal measurement, as related to the generation and removal of heat within semiconductor devices and to junction temperature measurement measurement under various conditions
Keywords :
cooling; integrated circuit packaging; multichip modules; semiconductor device packaging; thermal analysis; thermal variables measurement; MCM; electronic packaging; heat generation; heat removal; junction temperature measurement measurement; semiconductor devices; thermal analysis; thermal characterization; thermal management; thermal measurement; thermal modeling;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1995. SEMI-THERM XI., Eleventh Annual IEEE
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-2434-X
DOI :
10.1109/STHERM.1995.512066
