• DocumentCode
    2268203
  • Title

    The Effect of Correlated Failure on the Reliability of HPC Systems

  • Author

    Thanakornworakij, Thanadech ; Nassar, Raja ; Leangsuksun, Chokchai Box ; Paun, Mihaela

  • Author_Institution
    Coll. of Eng. & Sci., Louisiana Tech Univ., Ruston, LA, USA
  • fYear
    2011
  • fDate
    26-28 May 2011
  • Firstpage
    284
  • Lastpage
    288
  • Abstract
    High Performance Computing (HPC) system utilization can be maximized and sustained if one understands the failure behavior. In general, Time to Failure (TTF) of HPC systems has been long studied and showed that the Wei bull distribution gives the best fit. In addition, in many cases, TTF of such systems exhibit correlations. In our previous study, we developed a reliability model of an HPC system where failures among nodes are independent. However, some studies have clearly shown that in some cases nodes do not fail independently of one another. Therefore, it is of importance to develop a reliability model for an HPC system based on the occurrence of simultaneous failures. In this paper, we develop such a model and derive expressions for the probability density function of time to failure, system reliability, system failure rate, and mean time to failure (MTTF). Results show that if the failure of the components (nodes) in the system possesses a degree of dependency, the system reliability decreases.
  • Keywords
    Weibull distribution; software reliability; HPC systems; MTTF; Weibull distribution; high performance computing; mean time to failure; probability density function; reliability model; Computational modeling; Computers; Correlation; High performance computing; Mathematical model; Reliability; Weibull distribution; Failure rate; MTTTF; System Reliability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Parallel and Distributed Processing with Applications Workshops (ISPAW), 2011 Ninth IEEE International Symposium on
  • Conference_Location
    Busan
  • Print_ISBN
    978-1-4577-0524-3
  • Electronic_ISBN
    978-0-7695-4429-8
  • Type

    conf

  • DOI
    10.1109/ISPAW.2011.55
  • Filename
    5951989