• DocumentCode
    2268617
  • Title

    3TZ Collaborative Team Environments Incorporating the Hybrid Holonic Architecture

  • Author

    Chaczko, Zenon ; Chiu, Chris ; Klempous, Ryszard ; Nikodem, Jan

  • Author_Institution
    Fac. of Eng. & IT, Univ. of Technol., Sydney, NSW, Australia
  • fYear
    2010
  • fDate
    22-26 March 2010
  • Firstpage
    300
  • Lastpage
    305
  • Abstract
    The paper describes a business reengineering process (BPR) approach to address multi-timezone (3-timezone or 3TZ) collaborative teamwork environments by combining the Holonic architecture with the Zachman Metamodel Framework. While the use of collaborative project systems is not new, the methodology to share time resources from different timezones seeks to address pedagogical and engineering process concerns in team-based project development. The benefits of collaborative project management tools go beyond a uniform platform to deploy project resources, but to also enhance systemic processes and engineering practice. This facilitates team members to dedicate their time towards common work tasks, delineates individual and shared work packages, and improves student-tutor feedback techniques as teachers can actively monitor progress of development throughout the project lifecycle.
  • Keywords
    business process re-engineering; groupware; software engineering; 3TZ collaborative team environments; business reengineering process; collaborative project management; hybrid holonic architecture; multi-tiniezone collaborative teamwork environments; project development; Business process re-engineering; Collaboration; Collaborative tools; Collaborative work; Feedback; Monitoring; Packaging; Project management; Systems engineering and theory; Teamwork; 3 Time Zone (3TZ); 3TZ Virtual Labware; Business Process Reengineering (BPR) Holonic Architecture; Collaborative Project Development; Zachman Framework;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering of Computer Based Systems (ECBS), 2010 17th IEEE International Conference and Workshops on
  • Conference_Location
    Oxford
  • Print_ISBN
    978-1-4244-6537-8
  • Electronic_ISBN
    978-1-4244-6538-5
  • Type

    conf

  • DOI
    10.1109/ECBS.2010.42
  • Filename
    5457758