• DocumentCode
    2268976
  • Title

    Non-Fickian microscopic diffusion at interfaces and in thin films

  • Author

    Orlowski, Marius

  • Author_Institution
    Adv. Products Res. & Dev. Lab., Motorola Inc., Austin, TX, USA
  • fYear
    1994
  • fDate
    5-6 Jun 1994
  • Firstpage
    105
  • Lastpage
    108
  • Abstract
    This paper investigates the consequences of a random walk diffusion based on the multidimensional tensorial extension of the adjacency matrix concept on the dopant distribution at the interfaces and in thin films. The random walk concept used here provides a rigorous method of counting all possible random walk paths in an arbitrary 2D and 3D domain and avoids the conceptual inconsistencies of the conventional random walk´s treatment of the so called reflective barrier. The new approach leads to a new phenomenon of a depleted sub-barrier region characterized by a non-zero asymptotic relative gradient at the barrier instead of the vanishing gradient predicted by the conventional treatment. The depleted region extends over only several diffusional jump distances. In restricted diffusion domains in 2D and 3D geometries the depletion at the interface or in the corners is much stronger than in the one-dimensional case. The effects in 2D geometries are illustrated specifically on isolation structures in SOI films
  • Keywords
    diffusion; doping profiles; grain boundary diffusion; impurity distribution; isolation technology; silicon-on-insulator; 2D geometries; 3D geometries; SOI films; adjacency matrix concept; depleted sub-barrier region; diffusional jump distances; dopant distribution; grain boundary networks; isolation structures; multidimensional tensorial extension; nonFickian microscopic diffusion; nonzero asymptotic relative gradient; random walk diffusion; restricted diffusion domains; Boundary conditions; Doping; Geometry; Grain boundaries; Laboratories; Lattices; Microscopy; Research and development; Tensile stress; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Numerical Modeling of Processes and Devices for Integrated Circuits, 1994. NUPAD V., International Workshop on
  • Conference_Location
    Honolulu, HI
  • Print_ISBN
    0-7803-1867-6
  • Type

    conf

  • DOI
    10.1109/NUPAD.1994.343480
  • Filename
    343480