Title :
Reliable solid modeling for three-dimensional semiconductor process and device simulation
Author :
Westermann, M. ; Strecker, N. ; Regli, P. ; Fichtner, W.
Author_Institution :
Integrated Syst. Lab., Swiss Federal Inst. of Technol., Zurich, Switzerland
Abstract :
Since general-purpose 3D process simulators are currently not available, solid modelers greatly help the designer in building geometries for device simulators. In this contribution, a solid modeler is presented that allows reliable geometrical operations. In order to avoid numerical errors occurring at the intersection of objects built with polygons, we have chosen a data structure based on a discretization of the x-y plane of the simulation domain
Keywords :
VLSI; data structures; digital simulation; semiconductor process modelling; solid modelling; VLSI; data structure; device simulator geometries; geometrical operations; polygon object intersections; simulation domain; solid modeling; three-dimensional semiconductor process simulation; x-y plane discretization; Brushes; Circuit simulation; Data structures; Geometry; Mesh generation; Semiconductor device reliability; Semiconductor devices; Semiconductor process modeling; Solid modeling; Very large scale integration;
Conference_Titel :
Numerical Modeling of Processes and Devices for Integrated Circuits, 1994. NUPAD V., International Workshop on
Conference_Location :
Honolulu, HI
Print_ISBN :
0-7803-1867-6
DOI :
10.1109/NUPAD.1994.343493
