Reliable solid modeling for three-dimensional semiconductor process and device simulation

Author

Westermann, M. ; Strecker, N. ; Regli, P. ; Fichtner, W.

Author_Institution

Integrated Syst. Lab., Swiss Federal Inst. of Technol., Zurich, Switzerland

fYear

1994

fDate

5-6 Jun 1994

Firstpage

49

Lastpage

52

Abstract

Since general-purpose 3D process simulators are currently not available, solid modelers greatly help the designer in building geometries for device simulators. In this contribution, a solid modeler is presented that allows reliable geometrical operations. In order to avoid numerical errors occurring at the intersection of objects built with polygons, we have chosen a data structure based on a discretization of the x-y plane of the simulation domain

Keywords

VLSI; data structures; digital simulation; semiconductor process modelling; solid modelling; VLSI; data structure; device simulator geometries; geometrical operations; polygon object intersections; simulation domain; solid modeling; three-dimensional semiconductor process simulation; x-y plane discretization; Brushes; Circuit simulation; Data structures; Geometry; Mesh generation; Semiconductor device reliability; Semiconductor devices; Semiconductor process modeling; Solid modeling; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Numerical Modeling of Processes and Devices for Integrated Circuits, 1994. NUPAD V., International Workshop on

Conference_Location

Honolulu, HI

Print_ISBN

0-7803-1867-6

Type

conf

DOI

10.1109/NUPAD.1994.343493

Filename

343493