DocumentCode
2270077
Title
Sub-mW Operation of InP HEMT X-Band Low-Noise Amplifiers for Low Power Applications
Author
Lin, C.H. ; Mei, X.B. ; Chou, Y.C. ; Lee, L.S. ; Yang, J.M. ; Nishimoto, M.Y. ; Liu, P.H. ; To, R. ; Cavus, A. ; Tsai, R. ; Wojtowicz, M. ; Lai, R.
Author_Institution
Northrop Grumman Corp., Redondo Beach, CA, USA
fYear
2009
fDate
11-14 Oct. 2009
Firstpage
1
Lastpage
4
Abstract
For the first time, the sub-mW operation of InP HEMT X-band low-noise amplifiers on 4-inch InP wafer was demonstrated. With optimized non-alloyed ohmic contact, gate recess profile and epitaxial layer design, the InP HEMT achieves average peak transconductance of 1150 mS/mm at VDS = 0.3 V. The mean current cut off frequency is above 150 GHz at VDS = 0.3 V and IDS = 150 mA/mm. The developed low power InP HEMTs enables the manufacturing of low-noise amplifiers for low power applications. The superior performance of X-band low-noise amplifiers was also demonstrated. Operating at a supply voltage of 0.25 V and drain current of 3.75 mA with DC power of 0.937 mW, the low noise amplifier exhibits noise figure of 1.6 dB and gain of 11 dB at frequencies from 6 to 12 GHz.
Keywords
high electron mobility transistors; low noise amplifiers; low-power electronics; ohmic contacts; HEMT; X-band low noise amplifiers; average peak transconductance; current 3.75 mA; epitaxial layer design; frequency 6 GHz to 12 GHz; gain 11 dB; gate recess profile; high electron mobility transistors; low power application; mean current cut off frequency; noise figure 1.6 dB; optimized non-alloyed ohmic contact; power 0.937 mW; size 4 inch; voltage 0.25 V; voltage 0.3 V; Design optimization; Epitaxial layers; Frequency; HEMTs; Indium phosphide; Low-noise amplifiers; Manufacturing; Noise figure; Ohmic contacts; Transconductance;
fLanguage
English
Publisher
ieee
Conference_Titel
Compound Semiconductor Integrated Circuit Symposium, 2009. CISC 2009. Annual IEEE
Conference_Location
Greensboro, NC
ISSN
1550-8781
Print_ISBN
978-1-4244-5191-3
Electronic_ISBN
1550-8781
Type
conf
DOI
10.1109/csics.2009.5315662
Filename
5315662
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