Title :
Highly integrated three-dimensional MMIC single-chip receiver and transmitter
Author :
Toyoda, I. ; Tokumitsu, T. ; Aikawa, M.
Author_Institution :
NTT Human Interface Labs., Kanagawa, Japan
Abstract :
A three-dimensional (3D) MMIC structure with thin polyimide-film layers on wafers significantly increases the integration level of MMICs. We newly developed 9.2-12 GHz receiver and 9.5-14 GHz transmitter chips with 20 dB gain using 3D MMIC technology. The integration levels of these chips are nearly three times as high as those of conventional planar ones.
Keywords :
MMIC; microwave receivers; polymer films; radio transmitters; 20 dB; 9.2 to 12 GHz; 9.5 to 14 GHz; integration level; polyimide film; receiver; three-dimensional MMIC single-chip; transmitter; Conductive films; Gain; Low-noise amplifiers; MIM capacitors; MMICs; Mixers; Polyimides; Radio frequency; Radiofrequency amplifiers; Transmitters;
Conference_Titel :
Microwave Symposium Digest, 1996., IEEE MTT-S International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-3246-6
DOI :
10.1109/MWSYM.1996.512153
