DocumentCode :
2270876
Title :
On-Wafer Seamless Integration of GaN and Si (100) Electronics
Author :
Chung, Jin Wook ; Lu, Bin ; Palacios, Tomás
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Massachusetts Inst. of Technol., Cambridge, MA, USA
fYear :
2009
fDate :
11-14 Oct. 2009
Firstpage :
1
Lastpage :
4
Abstract :
The high thermal stability of nitride semiconductors allows for the on-wafer integration of (001)Si CMOS electronics and electronic devices based on these semiconductors. This paper describes the technology developed at MIT to seamlessly integrate GaN and Si transistors in very close proximity (<5 mum). This integration, the first of any III-V field effect transistor with (001) Si electronics, enables tremendous new possibilities to circuit and system designers. For example, we will study the use of hybrid GaN-Si circuits to improve the power distribution networks in Si microprocessors.
Keywords :
III-V semiconductors; MOSFET; elemental semiconductors; gallium compounds; high electron mobility transistors; microprocessor chips; silicon; thermal stability; wide band gap semiconductors; (001)Si CMOS electronics; GaN-Si; III-V field effect transistor; MOSFET; Si; Si microprocessors; Si(100) electronics; high electron mobility transistors; hybrid GaN-Si circuits; nitride semiconductors; on-wafer seamless integration; power distribution networks; thermal stability; CMOS technology; Epitaxial growth; Frequency; Gallium arsenide; Gallium nitride; HEMTs; MODFETs; MOSFETs; Radiofrequency amplifiers; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Compound Semiconductor Integrated Circuit Symposium, 2009. CISC 2009. Annual IEEE
Conference_Location :
Greensboro, NC
ISSN :
1550-8781
Print_ISBN :
978-1-4244-5191-3
Electronic_ISBN :
1550-8781
Type :
conf
DOI :
10.1109/csics.2009.5315780
Filename :
5315780
Link To Document :
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