DocumentCode
2270887
Title
Post-silicon verification methodology on Sun’s UItraSPARC T2
Author
Kumar, Jai ; Ahlschlager, Catherine ; Isberg, Peter
Author_Institution
Sun Microsyst. Microelectron. Group, Santa Clara
fYear
2007
fDate
7-9 Nov. 2007
Firstpage
47
Lastpage
47
Abstract
In general, considerable time and resources are spent during pre-silicon verification phase to proactively minimize functional issues at first silicon. This is no different on the UltraSPARC T2 - the world´s fastest commodity microprocessor. We deployed simulation, formal and emulation technologies coupled with solid methodology to cover all our bases, ensuring functional success of first silicon. A robust post-silicon verification methodology is critical to speeding up time-to-ramp and to prevent loss of product revenue. Formal verification has been deployed as one of the means to root cause silicon failure due to functional error. To ensure correct RTL fix, it is vital to be able to effectively reproduce a failure observed in silicon test and recreate it in RTL environment. One way of getting the RTL failure recreated quickly is by writing the failure scenario in terms of property and using formal tool to generate traces that lead to the failure. In this paper, we describe how simulation, formal and emulation technology coupled with capabilities instrumented in our test generators and RTL for repeatability helped isolate faults, run millions of new verification cycles to validate RTL fixes and formally prove the fixes to be error free. We also share impact of our post-silicon validation strategy on productization schedule of Sun UltraSPARC T2 processor.
Keywords
formal verification; logic simulation; logic testing; microprocessor chips; HW emulation; RTL failure; RTL fix; Sun Ultra SPARC T2 microprocessor; formal verification; post-silicon verification methodology; simulation technology; Emulation; Formal verification; Instruments; Isolation technology; Microprocessors; Robustness; Silicon; Solid modeling; Testing; Writing;
fLanguage
English
Publisher
ieee
Conference_Titel
High Level Design Validation and Test Workshop, 2007. HLVDT 2007. IEEE International
Conference_Location
Irvine, CA
ISSN
1552-6674
Print_ISBN
978-1-4244-1480-2
Type
conf
DOI
10.1109/HLDVT.2007.4392784
Filename
4392784
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