• DocumentCode
    2270887
  • Title

    Post-silicon verification methodology on Sun’s UItraSPARC T2

  • Author

    Kumar, Jai ; Ahlschlager, Catherine ; Isberg, Peter

  • Author_Institution
    Sun Microsyst. Microelectron. Group, Santa Clara
  • fYear
    2007
  • fDate
    7-9 Nov. 2007
  • Firstpage
    47
  • Lastpage
    47
  • Abstract
    In general, considerable time and resources are spent during pre-silicon verification phase to proactively minimize functional issues at first silicon. This is no different on the UltraSPARC T2 - the world´s fastest commodity microprocessor. We deployed simulation, formal and emulation technologies coupled with solid methodology to cover all our bases, ensuring functional success of first silicon. A robust post-silicon verification methodology is critical to speeding up time-to-ramp and to prevent loss of product revenue. Formal verification has been deployed as one of the means to root cause silicon failure due to functional error. To ensure correct RTL fix, it is vital to be able to effectively reproduce a failure observed in silicon test and recreate it in RTL environment. One way of getting the RTL failure recreated quickly is by writing the failure scenario in terms of property and using formal tool to generate traces that lead to the failure. In this paper, we describe how simulation, formal and emulation technology coupled with capabilities instrumented in our test generators and RTL for repeatability helped isolate faults, run millions of new verification cycles to validate RTL fixes and formally prove the fixes to be error free. We also share impact of our post-silicon validation strategy on productization schedule of Sun UltraSPARC T2 processor.
  • Keywords
    formal verification; logic simulation; logic testing; microprocessor chips; HW emulation; RTL failure; RTL fix; Sun Ultra SPARC T2 microprocessor; formal verification; post-silicon verification methodology; simulation technology; Emulation; Formal verification; Instruments; Isolation technology; Microprocessors; Robustness; Silicon; Solid modeling; Testing; Writing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Level Design Validation and Test Workshop, 2007. HLVDT 2007. IEEE International
  • Conference_Location
    Irvine, CA
  • ISSN
    1552-6674
  • Print_ISBN
    978-1-4244-1480-2
  • Type

    conf

  • DOI
    10.1109/HLDVT.2007.4392784
  • Filename
    4392784