Power semiconductor-driving technology for high power green electronic systems

Author

Lorenz, Leo

Author_Institution

ECPE, Germany

fYear

2012

fDate

23-25 April 2012

Firstpage

1

Lastpage

2

Abstract

The megatrends of our modern society such as energy efficiency, E-Mobility and SMART Grid is asking for green power electronic solutions.Power semiconductor devices are an enabling technology to meet these requirements. The major electrical improvement of the new generation of power devices is coming from the overall silicon utilization (vertical & horizontal device optimization). The reliability and ruggedness of these new power semiconductors is driven by an advanced chip interfacing and packaging technology. For ultra high efficiency and ultra high power density solutions WB-devices are being developed. However it has to be considered that the application engineer is faced with new challenges of how to manage all the parasitics, thermal management and circuit set up.

Keywords

elemental semiconductors; environmental factors; power semiconductor devices; semiconductor device packaging; semiconductor device reliability; silicon; E-mobility; Si; WB-devices; advanced chip interfacing technology; advanced chip packaging technology; green power electronic solutions; high-power green electronic systems; power semiconductor devices; silicon utilization; smart grid; thermal management; Abstracts; Consumer electronics; Packaging; Reliability; Silicon; Silicon carbide; Switches;

fLanguage

English

Publisher

ieee

Conference_Titel

VLSI Design, Automation, and Test (VLSI-DAT), 2012 International Symposium on

Conference_Location

Hsinchu

ISSN

PENDING

Print_ISBN

978-1-4577-2080-2

Type

conf

DOI

10.1109/VLSI-DAT.2012.6212586

Filename

6212586