Title :
Ultra-lightweight, high efficiency SiC based power electronic converters for extreme environments
Author :
Mounce, S. ; McPherson, B. ; Schupbach, R. ; Lostetter, A.B.
Author_Institution :
Arkansas Power Electron. Int., Inc., Fayetteville, AR
Abstract :
Silicon-carbide (SiC) semiconductor devices have numerous potential advantages over their conventional silicon counterparts (i.e., higher switching frequencies, lower switching losses, higher temperature of operation, higher blocking voltages, higher thermal conductivity, radiation hardness, etc.). These advantages have sparked the birth of a new generation of power converters, distinguishing themselves from their ancestors with a higher efficiency and operating frequency, resulting in a marked increase in power density and a considerable reduction in weight. This paper explores the feasibility of developing a highly efficient, ultra-lightweight SiC based DC/DC converter, including the electrical design philosophy, high-temperature packaging approaches, high-temperature testing of several key components, and the overall high-temperature package design. This technology will have important implications in many weight-sensitive applications such as aircrafts, satellite and NASA space exploration program. In addition, this technology will be highly beneficial for electronics that must operate in a high-temperature environment such as those located in the outside of spacecraft probes and landers
Keywords :
DC-DC power convertors; electronics packaging; high-temperature electronics; silicon compounds; space vehicle electronics; wide band gap semiconductors; DC-DC converter; NASA space exploration program; SiC; electrical design philosophy; high-temperature package design; high-temperature testing; power density; power electronic converters; semiconductor devices; spacecraft landers; spacecraft probes; weight reduction; Aerospace electronics; Electronics packaging; Power electronics; Semiconductor devices; Silicon carbide; Space technology; Switching frequency; Switching loss; Temperature; Thermal conductivity;
Conference_Titel :
Aerospace Conference, 2006 IEEE
Conference_Location :
Big Sky, MT
Print_ISBN :
0-7803-9545-X
DOI :
10.1109/AERO.2006.1655979