DocumentCode
2272185
Title
Advanced monolithic packaging concepts for high performance circuits and antennas
Author
Drayton, R.F. ; Henderson, R.M. ; Katehi, L.P.B.
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
Volume
3
fYear
1996
fDate
17-21 June 1996
Firstpage
1615
Abstract
Unwanted electromagnetic coupling between neighboring elements is a common problem in high frequency planar circuits. This paper reports on the elimination of crosstalk in planar circuits using conformal micromachined packaging. In the 5 to 30 GHz range, a back-to-back right-angle bend in microstrip has cross-coupling as high as -20 dB. The use of monolithic packaging concepts reduces this coupling by as much as 20-30 dB down to the noise level of the measurement system.
Keywords
antenna accessories; crosstalk; microstrip circuits; microwave antennas; packaging; 5 to 30 GHz; antenna; back-to-back right-angle bend; conformal micromachined packaging; cross-coupling; crosstalk; electromagnetic coupling; high frequency planar circuit; microstrip; monolithic packaging; Coupling circuits; Electromagnetic coupling; Electromagnetic radiation; Frequency; Laboratories; Microstrip; Noise level; Packaging; Silicon; VHF circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1996., IEEE MTT-S International
Conference_Location
San Francisco, CA, USA
ISSN
0149-645X
Print_ISBN
0-7803-3246-6
Type
conf
DOI
10.1109/MWSYM.1996.512247
Filename
512247
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