DocumentCode
2272229
Title
High frequency hermetic packages using LTCC
Author
Tsang-Der Ni ; Demarco, J. ; Sturzebecher, D. ; Cummings, M.
Author_Institution
US Army Res. Lab., Fort Monmouth, NJ, USA
Volume
3
fYear
1996
fDate
17-21 June 1996
Firstpage
1627
Abstract
This paper presents an experimental comparison of stripline versus modified coplanar waveguide transitions for use in high frequency hermetic packages. Low temperature co-fired ceramic is used as the substrate and wall material. It is shown that these hermetic wall transitions have low insertion loss at the designed frequency range from 30 GHz to 40 GHz, thus usable for an assortment of millimeter-wave packaging applications.
Keywords
ceramics; coplanar waveguides; millimetre wave circuits; packaging; strip lines; 30 to 40 GHz; LTCC; coplanar waveguide transition; high frequency hermetic package; insertion loss; low temperature co-fired ceramic; millimeter-wave package; stripline transition; wall transition; Ceramics; Coplanar waveguides; Electronic packaging thermal management; Electronics packaging; Frequency; Integrated circuit packaging; Microstrip; Millimeter wave technology; Stripline; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1996., IEEE MTT-S International
Conference_Location
San Francisco, CA, USA
ISSN
0149-645X
Print_ISBN
0-7803-3246-6
Type
conf
DOI
10.1109/MWSYM.1996.512250
Filename
512250
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