DocumentCode :
2272313
Title :
Stress field calculation for quantitative ultrasound elastography via integration of force sensors
Author :
Yuan, Lili ; Pedersen, Peder C.
Author_Institution :
ECE Dept., Worcester Polytech. Inst., Worcester, MA, USA
fYear :
2010
fDate :
26-28 March 2010
Firstpage :
1
Lastpage :
2
Abstract :
Most current elastography methods remain qualitative or display only strain information due to the inexact internal stress distribution. A more accurate result may be obtained by employing force sensors to gauge the applied vertical compression force on skin surface through the ultrasound transducer. A computationally efficient superposition algorithm based on Love´s closed-form equation (SLE) is presented. It performs analytical calculation of the 3D dynamic stress field inside a soft tissue phantom with non-free boundary conditions under a non-uniformly stressed rectangular linear array transducer, using the pressure on each element of the contact surface. The validity of the SLE method was tested by comparison to the stress field calculated with Finite Element Analysis (FEA). For the region of interest (directly underneath the ultrasound transducer), the SLE provides a sufficiently precise solution and can be exploited for absolute Young´s modulus reconstruction in real time.
Keywords :
Young´s modulus; biomechanics; biomedical ultrasonics; biosensors; elasticity; finite element analysis; force sensors; internal stresses; skin; ultrasonic imaging; ultrasonic transducer arrays; 3D dynamic stress field; Love closed-form equation; Young´s modulus; finite element analysis; force sensors; inexact internal stress distribution; nonfree boundary conditions; nonuniformly stressed rectangular linear array transducer; quantitative ultrasound elastography; skin surface; soft tissue phantom; stress field calculation; superposition algorithm; Capacitive sensors; Displays; Equations; Force sensors; Internal stresses; Performance analysis; Quantum computing; Skin; Ultrasonic imaging; Ultrasonic transducers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Bioengineering Conference, Proceedings of the 2010 IEEE 36th Annual Northeast
Conference_Location :
New York, NY
Print_ISBN :
978-1-4244-6879-9
Type :
conf
DOI :
10.1109/NEBC.2010.5458125
Filename :
5458125
Link To Document :
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