• DocumentCode
    2272758
  • Title

    Modeling the strain fields for an in-vivo bone growth experiment

  • Author

    Guo, Hongqiang ; Spilker, Robert ; Brunski, John

  • Author_Institution
    Rensselaer Polytech. Inst., Troy, NY, USA
  • fYear
    2010
  • fDate
    26-28 March 2010
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Osseointegration is critical for implant fixation, and mechanical stimuli play a role in this process. Our long term goal is to investigate the relationship between local mechanical environment and osseointegration. In this paper, as a first step in the study, we constructed an approximate 3D model of the in-vivo test and focused on calculating the strain fields around the implant. We first demonstrated that 3D finite element models gave significant differences compared with 2D models. The 3D model was then used to study strain distributions as gap tissue properties were varied over an experimentally estimated range in the first 7 days post implant. Results for strain concentration in gap tissue around the circumferential ridges and bottom of the implant agreed, on average, with previous 2D studies. Variations of the strain field around the implant were consistent with bone healing and remodeling trends around the implant between post-surgical days 1 and 5, and 6 and 7.
  • Keywords
    biomechanics; bone; finite element analysis; prosthetics; 3D finite element models; approximate 3D model; gap tissue; implant; in-vivo bone growth; local mechanical environment; osseointegration; strain concentration; strain distributions; strain fields; Aging; Auditory implants; Bones; Capacitive sensors; Finite element methods; Geometry; Joints; Mice; Performance analysis; Testing; finite element model; implant; mechanical stimuli; osseointegration; strain;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Bioengineering Conference, Proceedings of the 2010 IEEE 36th Annual Northeast
  • Conference_Location
    New York, NY
  • Print_ISBN
    978-1-4244-6879-9
  • Type

    conf

  • DOI
    10.1109/NEBC.2010.5458150
  • Filename
    5458150