DocumentCode
2272949
Title
Circuit models for plastic packaged microwave diodes
Author
Brown, B. ; Hiller, G.
Author_Institution
MA-COM Inc., Burlington, MA, USA
Volume
3
fYear
1996
fDate
17-21 June 1996
Firstpage
1779
Abstract
This paper reports on the measurement and establishment of circuit models for SOT-23 and SOD-323 packaged diodes. Results indicate that the 1.5 nH estimate for the SOT-23 is a useful result as is 1.2 nH for SOD-323 single packaged diodes. It was also determined that the effective inductance of the SOT-23 may be reduced to approximately 0.4 nH by adding a second bond wire and modifying the microstrip line. Other lead configurations including parallel bond wires and common cathode configurations were also studied.
Keywords
equivalent circuits; inductance; microwave diodes; plastic packaging; semiconductor device packaging; SOD-323 package; SOT-23 package; bond wire addition; circuit models; common cathode configurations; effective inductance; lead configurations; microstrip line; parallel bond wires; plastic packaged microwave diodes; Circuit simulation; Circuit testing; Diodes; Electrical resistance measurement; Fixtures; Frequency measurement; Impedance measurement; Microwave circuits; Microwave devices; Plastic packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1996., IEEE MTT-S International
Conference_Location
San Francisco, CA, USA
ISSN
0149-645X
Print_ISBN
0-7803-3246-6
Type
conf
DOI
10.1109/MWSYM.1996.512288
Filename
512288
Link To Document