A compact system-level simulation method for modern microelectronic packaging

For wafer-level packages with numerous solder balls and other repetitive structures, it´s not practical to analyze the wafer-level behavior of the whole structure with the conventional finite-element method (FEM). A package-level nodal analysis method (PLNAM) is developed based on the partitioning concept. Using the functional elements, rather than the finite element in FEM, a large or complex package system can be interpreted using a simpler model with the elements interconnected through nodes. Result shows that the error of the nodal displacement can be kept within 5% with proper consideration of the surface compliance effect and the simulation process is much faster than FEM.