Title :
The anti-pyramid distribution in SIP using LTCC technology
Author :
Liu, Yingli ; Li, Yuanxun ; Xie, Yunsong ; Zhang, Huaiwu ; Chen, Daming ; Li, Jie
Author_Institution :
State Key Lab. of Electron. Thin Film & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
Abstract :
The anti-pyramid stacked chips distribution that can be applied in SIP is reported to have a much better thermal performance comparing to the widely used pyramid distribution. When the package of system is using PCB and LTCC condition, the highest temperature is brought down from 440°K to 417°K and from 326°K to 319°K respectively. In addition, it is also analyzed that the anti-pyramid distribution makes the LTCC packaged system not only has better thermal performance, but also be more reliable. So it is strongly suggested that when the SIP encounter some serious thermal problem, both anti-pyramid stacked chips and LTCC technology should be applied to overcome this problem.
Keywords :
ceramic packaging; reliability; system-in-package; LTCC technology; anti-pyramid stacked chips distribution; system-in-package; temperature 319 K to 326 K; temperature 417 K to 440 K; thermal performance; Electronic packaging thermal management; Electronics packaging; Heating; Substrates; System-on-a-chip; Temperature distribution; Thermal conductivity;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
DOI :
10.1109/ICEPT.2010.5582381
