Title :
An MCM package process for 24GHz driver amplifier using photosensitive BCB
Author :
Tang, Jiajie ; Wang, Huajiang ; Xiao Chen ; Ning, Wenguo ; Xu, Gaowei ; Xiaowei Sun ; Luo, Le
Author_Institution :
Shanghai Inst. of Microsyst. & Inf. Technol., CAS, Shanghai, China
Abstract :
This paper presents a wafer-level microwave multichip module (MMCM) packaging process for 24GHz driver amplifier using photosensitive-Benzocyclobutene (photo-BCB) of 25 μm. It is developed for multilayer interconnection of monolithic microwave integrated chip (MMIC). A 24 GHz driver amplifier chip is embedded in a wet-etched trench on 4 inch lossy Si wafer and covered with a layer of BCB as dielectrics. Microstrip lines are fabricated with two layers of metal patterns to connect pads on MMIC with the test pads on MCM package in case of excessive loss. The interlayer connection resistance of this metal/BCB interconnection structure is tested with interconnection chain structures through Kelvin resistance measurement. The electrical characteristics of the package are also illustrated. The gain of the amplifier (S21) after packaging is more than 22dB from 21GHz to 26 GHz, and the S21 changes when packaged is less than 2 dB. The return loss S11 and S22 is less than -14.1dB and -17.3dB from 21GHz to 26GHz.
Keywords :
MMIC amplifiers; driver circuits; elemental semiconductors; microstrip lines; multichip modules; silicon; wafer level packaging; Kelvin resistance measurement; MCM package process; MMCM packaging process; MMIC; Si; driver amplifier chip; electrical characteristics; frequency 21 GHz to 26 GHz; interconnection chain structures; interlayer connection resistance; lossy Si wafer; metal-BCB interconnection structure; microstrip lines; monolithic microwave integrated chip; multilayer interconnection; photosensitive BCB; photosensitive-Benzocyclobutene; return loss; size 25 mum; size 4 inch; wafer-level microwave multichip module packaging process; wet-etched trench; Electrical resistance measurement; Gold; MMICs; Packaging; Resistance; Silicon;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
DOI :
10.1109/ICEPT.2010.5582382
