Title :
Signatures of Electromechanical Faults in Stress Distribution and Vibration of Induction Motors
Author :
Rodriguez, P.V.J. ; Belahcen, A. ; Laiho, A. ; Resina, E. ; Arkkio, A.
Author_Institution :
Helsinki Univ. of Technol., Helsinki
Abstract :
This paper develops a method for determining the signatures of electromechanical faults in the airgap stress distribution and stator vibration of induction machines. Two types of induction motors are analyzed; a 2-pole pairs, star connected and an 1-pole pair, delta connected motor. The radial electromagnetic stress distribution along the airgap is calculated and developed into double Fourier series in space and time. The computations show the existence of low frequency and low order stress distributions acting on the stator of the electrical machine when it is working under faulty conditions. These stress waves are able to produce forced vibration in the stator surface. The simulation results are corroborated by vibration measurements. Modal testing is also carried out to determine the natural frequencies. The measurements and simulations show that low frequency components of the vibrations can be used as identifiable signatures for condition monitoring of induction motors. The patterns presented by the faults allow to discriminate between them.
Keywords :
fault diagnosis; induction motors; stators; vibration measurement; 1 pole pair delta connected motor; 2 pole pairs star connected motor; airgap stress distribution; double Fourier series; electromechanical faults; induction machines; induction motors; modal testing; radial electromagnetic stress distribution; signatures; stator vibration; vibration measurements; Computational modeling; Distributed computing; Fourier series; Frequency; Induction machines; Induction motors; Stators; Stress; Surface waves; Vibration measurement; Finite Elements Method; Fourier series; fault; induction motor; modal testing; stress; vibration;
Conference_Titel :
Diagnostics for Electric Machines, Power Electronics and Drives, 2007. SDEMPED 2007. IEEE International Symposium on
Conference_Location :
Cracow
Print_ISBN :
978-1-4244-1061-3
Electronic_ISBN :
978-1-4244-1062-0
DOI :
10.1109/DEMPED.2007.4393089