Thermally induced packaging effect of a distributed MEMS phase shifter

Author

Zhao, Cheng ; Song, Jing ; Huang, Qing-An

Author_Institution

Key Lab. of MEMS of Minist. of Educ., Southeast Univ., Nanjing, China

fYear

2010

fDate

16-19 Aug. 2010

Firstpage

508

Lastpage

510

Abstract

Since radio-frequency microelectromechanial devices work mechanically, they are sensitive to thermally induced packaging effects. These effects will have impacts on their microwave performances and reliability. In this paper, the possible effect of the thermal stress and strain induced in die attaches process on the microwave characteristics of packaged distributed MEMS phase shifters is studied. Theoretical models are established, and full wave electromagnetic simulations are involved. Results show that the thermally induced packaging effect has considerable impact on the phase shift performance of the device.

Keywords

electronics packaging; microassembling; micromechanical devices; microwave devices; phase shifters; thermal management (packaging); thermal stresses; die attach process; distributed MEMS phase shifter; radio frequency microelectromechanial devices; strain induced; thermal stress; thermally induced packaging effect; Bridge circuits; Electronic packaging thermal management; Micromechanical devices; Packaging; Phase shifters; Strain; Stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on

Conference_Location

Xi´an

Print_ISBN

978-1-4244-8140-8

Type

conf

DOI

10.1109/ICEPT.2010.5582394

Filename

5582394